Complete x8 subsystem solution in TSMC N3 process demonstrates industry readiness for mass production and de-risks adoption for […]
News / Press Release
Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging
Running on Allegro AI Studio, the AuraStack AI Super Agent delivers up to 2X faster time to market, […]
News / Press Release
Cadence Unveils Industry’s First Fully Autonomous Virtual Engineer for Chip Design, powered by NVIDIA
Level-5 ChipStack AI Super Agent framework and NVIDIA OpenShell runtime advance secure, agentic AI across semiconductor development At […]
News / Press Release
Cadence and Samsung Foundry Deepen 2nm and 3D-IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand
Multi-year agreement expands Memory, NVIDIA NVLink-C2C and advanced Interface IP, and agentic AI-optimized GPU-accelerated EDA and SDA flows […]
News / Press Release
Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency
Cadence (Nasdaq: CDNS) today announced that Aeva, a leader in next-generation sensing and perception systems, has licensed Cadence® […]